Brief introduction
| model | HongJin-T3500 |
| Specification | 300ml/branch |
| characteristic | HongJin-T3500 is a one-component room temperature curing silicone thermal conductive adhesive, which is cross-linked and cured by condensation reaction in contact with moisture in the air, and becomes a high-performance elastomer. After curing, it is closely attached to the surface in contact with it to reduce the thermal resistance, which is beneficial to the heat conduction between the heat source and the surrounding heat sink or the main board and the casing. This series of products have excellent thermal conductivity, good electrical insulation properties, excellent moisture resistance, shock resistance, corona resistance and anti-leakage properties, high and low temperature resistance, non-swelling and good adhesion to most metal and non-metal materials. It can seal and bond electronic components. |
| Applicable Products | Widely used in heat conduction and bonding between high-power power modules and radiators; heat conduction and bonding between LED lamp aluminum substrates and radiators; cache memory; integrated circuits, CPU processors; power modules, DC/AC converters ;Power modules, power tubes, diodes, triodes, semiconductors, relays, transformers, ballasts, thermally conductive filling and bonding; can replace the traditional way of fixing with circlips and screws |
Technical parameter
| Exterior | White or gray viscous paste |
| Viscosity（mpa.s） | 1000 |
| density（g/cm3） | 1.75±0.5 |
| hardness（Shaw BrothersA） | 30～60 |
| Dry time（min） | 15～35 |
| Tensile Strength（7sky，25℃，50%RH） | ≥1.0Mpa |
| Shear strength（MPa）,7sky25℃/50%RH,AL/AL | ≥0.6 |
| Thermal Conductivity（W/m.K） | 1.5 |
Precautions
1、Clean and dry the surface to be adhered to.
2、Squeeze the glue onto the cleaned and clean surface to make it evenly distributed, just close and fix the surface to be adhered, the bonding strength is not the more adhesive the better, the most important is uniform.
3、The thickness of the potting should not exceed 5mm as far as possible. The deeper the adhesive layer is, the longer the curing time is.
4、The speed of curing is related to temperature and humidity. High temperature and high humidity can promote moisture curing. It takes 7 days to fully cure.
5、It is recommended to store in a dry and cool place below 30°C.
Landline ：0755-28307837
Mail ：sales@szhjtec.com
contact ：吳先生 18688927121
王先生 13332958891
address ：深圳市龍崗區(qū)坪地街道教育北路49號(hào)5B棟501
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